Article citationsMore>>

L. L. Mercado and B. Chavez, “Impact of JEDEC Test Conditions on New-Generation Package Reliability,” IEEE Transactions on Components and Packaging Tech- nologies, Vol. 25, No. 2, 2002, pp. 204-210. doi:10.1109/TCAPT.2002.1010007

has been cited by the following article:

Follow SCIRP
Twitter Facebook Linkedin Weibo
Contact us
+1 323-425-8868
customer@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1655362766
Paper Publishing WeChat
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top