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Ichitsubo, T., Matsubara, E., Fujiwara, K., Yamaguchi, M., Irie, H., Kumanoto, S. and Anada, T. (2005) Control of Compound Forming Reaction at the Interface Between SnZn Solder and Cu Substrate. Journal of Alloys and Compounds, 392, 200-205. https://doi.org/10.1016/j.jallcom.2004.09.043

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