Journal of Electronics Cooling and Thermal Control

Journal of Electronics Cooling and Thermal Control

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org
"Air Cooling of Mini-Channel Heat Sink in Electronic Devices"
written by Mousa M. Mohamed, Mostafa A. Abd El-Baky,
published by Journal of Electronics Cooling and Thermal Control, Vol.3 No.2, 2013
has been cited by the following article(s):
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[2] Numerical study on forced convection of water-based suspensions of nanoencapsulated PCM particles/Al2O3 nanoparticles in a mini-channel heat sink
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[3] Numerical Simulation and Parametric Study of the Convection Heat Transfer in a Micro-Channel Heat Sink with the Elliptical Pin Fins
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[4] شبیه سازی عددی و مطالعه پارامتری انتقال گرمای جابجایی در یک چاه گرمایی میکروکانالی با پره های پین شده بیضوی‎
2020
[5] Effect of micro-channel technique on solar collector performance
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[6] Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure
International Conference on Research in Mechanical Engineering Sciences (RiMES 2017), 2018
[7] Numerical and experimental study of cellular structures as a heat dissipation media
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[8] Water Cooled Micro-hole Cellular Structure as a Heat Dissipation Media: An Experimental and Numerical Study
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[9] Experimental investigation on heat transfer enhancement from a channel with square blocks and identification of most influencing parameters using Taguchi approach
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[10] NUMERICAL INVESTIGATION OF LAMINAR NANOFLUID FLOW IN MICRO CHANNEL HEAT SINKS
INTERNATIONAL JOURNAL OF MECHANICAL ENGINEERING AND TECHNOLOGY(IJMET), 2014
[11] Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon
Journal of Electronics Cooling and Thermal Control, 2013
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