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H. Y. Zhang, D. Pingala, T. N. Wong, K. C. Toh and Y. K. Joshi, “Single-Phase Liquid Cooled Micro Channel Heat Sink for Electronic Packages,” Applied Thermal Engineering, Vol. 25, No. 2, 2005, pp. 1472-1487. doi:10.1016/j.applthermaleng.2004.09.014

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