TITLE:
A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera
AUTHORS:
Michel Saydé, Ahmed Lakhssassi, Emmanuel Kengne, Roman Palenichka
KEYWORDS:
Thermal Monitoring; Ring Oscillator (RO); Spatial; Spatiotemporal; Thermo-Mechanical Stress; Temperature Sensor; Thermal Analysis; WaferIC; Wafer-Scale System
JOURNAL NAME:
Journal of Biosciences and Medicines,
Vol.1 No.2,
November
8,
2013
ABSTRACT: In
this paper, we describe a new silicon-die thermal monitoring approach using spatiotemporal
signal processing technique for Wafer-Scale IC thermome- chanical stress
monitoring. It is proposed in the context of a wafer-scale-based (WaferICTM)
rapid prototyping platform for electronic systems. This technique will be
embedded into the structure of the WaferIC, and will be used as a preventive
measure to protect the wafer from possible damages that can be caused by
excessive thermomechanical stress. The paper also presents spatial and
spatiotemporal algorithms and the experimental results from an IR images
collection campaign conducted using an IR camera.