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H. Ching-Yen, T. Yu-Hsiang and S. Feng-Ming, “Thermal Transport in the Copper Powders with Nanometer and Micrometer Particles,” Advanced Materials Research, Vol. 126-128, 2010, pp. 952-956956. http://dx.doi.org/10.4028/www.scientific.net/AMR.126-128.952

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