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S. Ebbens, D. Hutt and C. Q. Liu, “The Thermal Stability of Alkanethiol Self-Assembled Monolayers on Copper for Fluxless Soldering Applications,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, 2010, pp. 251-259. doi:10.1109/TCAPT.2010.2041779

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