G. H. Wu, S.H. Ju and T. C. Tsein, “Three-Dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-Chip Packages under Temperature Cycling Conditions,” Journal of Reinforced Plastics and Composites, Vol. 24, No. 18, 2005, pp. 1895-1907.doi10.1177/0731684405054333 - References

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G. H. Wu, S.H. Ju and T. C. Tsein, “Three-Dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-Chip Packages under Temperature Cycling Conditions,” Journal of Reinforced Plastics and Composites, Vol. 24, No. 18, 2005, pp. 1895-1907. doi:10.1177/0731684405054333

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