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H. Haberland, M. Mall, M. Moseler, Y. Qian, T. Reiners and Y. Thurner, “Filling of Micron-Sized Contact Holes with Copper by Energetic Cluster-Impact,” Journal of Vacuum Science & Technology A: Vacuum Surfaces and Films, Vol. 12, No. 5, 1994, pp. 2925-2930.

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