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C. P. Wong and R. S. Bollampally, “Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging,” Journal of Applied Polymer Science, Vol. 74, No. 14, pp. 3396-3403. doi:10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3

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