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Fan, J., Jiang, D., Zhang, H., Hu, D., Liu, X., Fan, X. and Zhang, G. (2022) High-Temperature Nanoindentation Characterization of Sintered Nano-Copper Particles Used in High Power Electronics Packaging. Results in Physics, 33, Article ID: 105168.
https://doi.org/10.1016/j.rinp.2021.105168

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