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https://doi.org/10.1002/adfm.200700902

has been cited by the following article:

• TITLE: Preparation of Cu@Ag Nanoparticles for Conductive Ink

  AUTHORS: Sijie Wang, Helong Yu

  KEYWORDS: Printed Electronics, Conductive Ink, Core-Shell Nanoparticles, Antioxidant

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.9 No.9, September 14, 2021

  ABSTRACT: In order to overcome the shortcomings of low-cost anti-oxidation conductive ink and its preparation method in the field of printing electronics, core-shell coated Cu@Ag nanoparticles were used to prepare conductive ink, and a printed circuit was obtained by inkjet printing. Copper nanoparticles were prepared by a chemical reduction method and then coated with Cu@Ag particles by a copper-based self-catalytic reaction. Conductive ink was prepared by ball milling and dispersion and printed on PI film to form a conductive coating. After characterization and analysis, the particle size and dispersion of the obtained Cu@Ag meet the requirements and can be stored stably under normal atmospheric conditions. The resistivity of the conductive film sintered at 300˚C is only 10.6 μΩ∙cm.