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Xiong, W., Jiang, M., Zhu, M., Zhu, B. and Lu, J. (2018) Analysis of Electromagnetic Shielding of IC Package with Thin Absorbing Material Coating Inside in Two Different Configuration. 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 14-18 May 2018, 1216-1221.
https://doi.org/10.1109/ISEMC.2018.8393982

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