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Y. Gaoa, C. Zou, B. Yang, Q. Zhai, J. Liu, E. Zhuravlevd and C. Schick, “Nanoparticles of SnAgCu Lead-Free Solder Alloy with an Equivalent Melting Temperature of SnPb Solder Alloy,” Journal of Alloy and Compounds, Vol. 484, No. 1-2, 2009, pp. 777-781. doi:10.1016/j.jallcom.2009.05.042

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