Jin, Y.-Q., Tao, L., Chi, Y. and Yan, J.-H. (2011) Conversion of Bromine during Thermal Decomposition of Printed Circuit Boards at High Temperature. Journal of Hazardous Materials, 186, 707-712.
https://doi.org/10.1016/j.jhazmat.2010.11.050

has been cited by the following article:

• TITLE: Thermal Decomposition of Printed Circuit Board in the Presence of Zinc Oxide under Inert and Oxidative Atmosphere: Emission Behavior of Inorganic Brominated Compounds

  AUTHORS: Osamu Terakado, Shunsuke Kuzuhara, Hironori Takagi, Masahiro Hirasawa

  KEYWORDS: Printed Circuit Board, Brominated Flame Retardants, Hydrogen Bromide, Bromine, Emission Control

  JOURNAL NAME: Engineering, Vol.10 No.9, September 21, 2018

  ABSTRACT: Thermal degradation of a FR-4 type printed circuit board, PCB, containing brominated flame retardant has been studied both in inert and oxidative atmosphere for the emission control of harmful brominated compounds. The presence of oxygen in atmosphere resulted in the reduction of the yield of hydrogen bromide, one of the major brominated compounds in thermal treatment, and in the enhancement of the formation of bromine and hypobromous acid. The intentional addition of zinc oxide to the PCB powder sample gave rise to the fixation of Br as zinc bromide. It also resulted in the promotion of the release of brominated compounds in comparison to the case of pure PCB. Thus, the addition of the oxide can be a benefit with respect to the bromine fixation and the kinetics of thermal treatment of PCB as well as metal recovery.