Chang, T.C., Hon, M.H. and Wang, M.C. (2004) Electrochemical Behaviors of the Sn-9Zn-xAg Lead-Free Solders in a 3.5 wt% NaCl Solution. Journal of the Electrochemical Society, 151, C484-C491.
https://doi.org/10.1149/1.1756890

has been cited by the following article:

• TITLE: Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

  AUTHORS: E. A. Eid, Manal A. Ramadan, A. B. El Basaty

  KEYWORDS: Sn-Zn-Al-Sb Alloys, Lead Free Solders, Sb Addition, Creep Properties

  JOURNAL NAME: Engineering, Vol.10 No.1, January 31, 2018

  ABSTRACT: The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130°C. The stress exponent increases as the temperature drops from 100°C to 50°C, except for the 1.0% Sb alloy, where n 5.3 - 6.1 at all the temperature range (T = 50°C, 100°C and 130°C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.