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Date, M., Tu, K.N., Shoji, T., Fujiyoshi, M. and Soto, K. (2004) Interfacial Reactions and Impact Reliability of Sn-Zn Solder Joints on Cu or Electroless Au/Ni(P) Bond-Pads. Journal of Materials Research, 19, 2887.
https://doi.org/10.1557/JMR.2004.0371

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