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Wang, L., Yu, D.Q., Zhao, J. and Huang, M.L. (2002) Improvement of Wettability and Tensile Property in Sn-Ag-RE lead-Free Solder Alloy. Materials Letters, 56, 1039-1042.
https://doi.org/10.1016/S0167-577X(02)00672-9

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