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Hirose, A., Yanagawa, H., Ide, E. and Kobayashi, K.F. (2004) Joint Strength and Interfacial Microstructure between Sn-Ag-Cu and Sn-Zn-Bi Solders and Cu Substrate. Science and Technology of Advanced Materials, 5, 267.
https://doi.org/10.1016/j.stam.2003.10.024

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