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Chang, T.C., Hon, M.H. and Wang, M.C. (2003) Intermetallic Compounds Formation and Interfacial Adhesion Strength of Sn-9Zn-0.5Ag Solder Alloy Hot-Dipped on Cu Substrate. Journal of Alloys and Compounds, 352, 168.
https://doi.org/10.1016/S0925-8388(02)01122-2

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