Article citationsMore>>

Z. Gu, Y. Han, F. Pan, X. Wang, D. Weng and S. Zhou, “Production and Properties of a 90%Si-Al Alloy for Electronic Packaging Applications,” Materials Science Forum, Vol. 610-613, 2009, pp. 542-545. doi.org/10.4028/www.scientific.net/MSF.610-613.542

has been cited by the following article:

Follow SCIRP
Twitter Facebook Linkedin Weibo
Contact us
+1 323-425-8868
customer@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1655362766
Paper Publishing WeChat
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top