R. J. Chang, P. W. Shih, R. Z. Huang, and K. L. Lin, “Application of piezo-driven polymer microgripper in automatic transportation of micro object,” IEEE International Conference of Mechatronics, pp. 140–144, 2005.

has been cited by the following article:

• TITLE: Using Microgripper in Development of Automatic Adhesive Glue Transferring and Binding Microassembly System

  AUTHORS: R. J. CHANG, C. C. CHEN

  KEYWORDS: Micro Gripper, Adhesive Bonding, Microassembly, Visual Servo

  JOURNAL NAME: Engineering, Vol.2 No.1, January 27, 2010

  ABSTRACT: A system using microgripper for gluing and adhesive bonding in automatic microassembly was designed, implemented, and tested. The development of system is guided by axiomatic design principle. With a compliant PU microgripper, regional-edge-statistics (RES) algorithm, and PD controller, a visual-servoing system was implemented for gripping micro object, gluing adhesive, and operating adhesive bonding. The RES algorithm estimated and tracked a gripper’s centroid to implement a visual-servoing control in the microassembly operation. The main specifications of the system are: gripping range of 60~80μm, working space of 7mm×5.74mm×15mm, system bandwidth of 15Hz. In the performance test, a copper rod with diameter 60μm was automatically gripped and transported for transferring glue and bonding. The 60μm copper rod was dipped into a glue container and moved, pressed and bonding to a copper rod of 380μm. The amount of binding glue was estimated about 5.7nl.