Sridhar, A., Madhour, Y., Atienza, D., Brunschwiler, T. and Thome, J. (2013) STEAM A Fast Compact Thermal Model for Two-Phase Cooling of Integrated Circuits. Proc. Int. Conf. on Comput.- Aided Des., 256-263. - References

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Sridhar, A., Madhour, Y., Atienza, D., Brunschwiler, T. and Thome, J. (2013) STEAM: A Fast Compact Thermal Model for Two-Phase Cooling of Integrated Circuits. Proc. Int. Conf. on Comput.- Aided Des., 256-263. http://dx.doi.org/10.1109/iccad.2013.6691127

has been cited by the following article:

TITLE: Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs

AUTHORS: Hong-Wen Chiou, Yu-Min Lee

KEYWORDS: Thermal Simulation, Microchannel, Two-Phase Liquid Cooling

JOURNAL NAME: Journal of Computer and Communications, Vol.4 No.15, November 28, 2016

ABSTRACT: This work presents an algorithm for simulating more accurate temperature distribution in two-phase liquid cooling for three-dimensional integrated circuits than the state of-the-art methods by utilizing local multi-linear interpolation techniques on heat transfer coefficients between the microchannel and silicon substrate, and considering the interdependence between the thermal conductivity of silicon and temperature values. The experimental results show that the maximum and average errors are only 9.7% and 6.7% compared with the measurements, respectively.