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Mita, M., Kajihara, M., Kurokawa, N. and Sakamoto, K. (2005) Growth Behavior of Ni3Sn4 Layer during Reactive Diffusion between Ni and Sn at Solid-State Temperatures. Journal of Material Science and Engineering A, 403, 269-275.
http://dx.doi.org/10.1016/j.msea.2005.05.012

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