Article citationsMore>>

Sonehara, T., Hokazono, A., Akutsu, H., Sasaki, T., Uchida, H., Tomita, M., Kawanaka, S., Inaba, S. and Toyoshima, Y. (2011) Mechanism of Contact Resistance Reduction in Nickel Silicide Films by Pt Incorporation. IEEE Transactions on Electron Devices, 58, 3778-3786.

has been cited by the following article:

Follow SCIRP
Twitter Facebook Linkedin Weibo
Contact us
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1655362766
Paper Publishing WeChat
Free SCIRP Newsletters
Copyright © 2006-2023 Scientific Research Publishing Inc. All Rights Reserved.