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Sonehara, T., Hokazono, A., Akutsu, H., Sasaki, T., Uchida, H., Tomita, M., Kawanaka, S., Inaba, S. and Toyoshima, Y. (2011) Mechanism of Contact Resistance Reduction in Nickel Silicide Films by Pt Incorporation. IEEE Transactions on Electron Devices, 58, 3778-3786.
http://dx.doi.org/10.1109/TED.2011.2166557

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