Article citationsMore>>

Yung, K.C., Wang, J. and Yue, T.M. (2008) Thermal Management for Boron Nitride Filled Metal Core Printed Circuit Board. Journal of Composite Materials, 42, 2615.

has been cited by the following article:

Follow SCIRP
Twitter Facebook Linkedin Weibo
Contact us
Free SCIRP Newsletters
Copyright © 2006-2021 Scientific Research Publishing Inc. All Rights Reserved.