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F. Lefevre and M. Lallemand, “Coupled Thermal and Hy-drodynamic Models of Flat Micro Heat Pipes for the Cooling of Multiple Electronic Components,” Interna-tional Journal of Heat and Mass Transfer, Vol. 49, No. 7-8, 2006, pp. 1375-1383.
UUU-doi:10.1016/j.ijheatmasstransfer.2005.10.001UUU
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