Design a Collector with More Reliability against Defects during Manufacturing in Nanometer Technology, QCA

Milad Sang Sefidi, Dariush Abedi, Mehdi Moradian

Computer Engineering Department, Sadjad University, Mashhad, Iran.
Computer Engineering Department, Shahid Beheshti University, Tehran, Iran.
Electrical Engineering Faculty, Sahand University of Technology, Sahand, Iran.

DOI: 10.4236/jsea.2013.66038                

Abstract

Nowadays Quantum Cellular Automata (QCA) as the leading technology in design of microelectronic systems has been raised. With respect to high velocity and density in low power and also simple concepts, this technology is a viable alternative to CMOS technology. In collector design, the primary component of each processor is very important. Due to the small elements in this technology, failure rate in manufacturing process technology is very high. In the other hand, the simulation shows that the intersection point of two wires is one of the critical points in QCA circuits. This means that defects in the manufacturing process around these points can cause malfunction in the circuit performance. In this paper, a collector in cross sections of wire in his new method used higher reliability against defects during manufacturing has been developed. QCA Designer software is used to simulate the case study system.

Keywords

Collector; Quantum Dot Cells; Fault Tolerance; Quantum Cellular Automata; Nano-Scale Technologies

Conflicts of Interest

The authors declare no conflicts of interest.

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