Composite Materials Damage Modeling Based on Dielectric Properties

Abstract

Composite materials, by nature, are universally dielectric. The distribution of the phases, including voids and cracks, has a major influence on the dielectric properties of the composite materials. The dielectric relaxation behavior measured by Broadband Dielectric Spectroscopy (BbDS) is often caused by interfacial polarization, which is known as Maxwell-Wagner-Sillars polarization that develops because of the heterogeneity of the composite materials. A prominent mechanism in the low frequency range is driven by charge accumulation at the interphases between different constituent phases. In our previous work, we observed in-situ changes in dielectric behavior during static tensile testing, and also studied the effects of applied mechanical and ambient environments on composite material damage states based on the evaluation of dielectric spectral analysis parameters. In the present work, a two dimensional conformal computational model was developed using a COMSOL multi-physics module to interpret the effective dielectric behavior of the resulting composite as a function of applied frequency spectra, especially the effects of volume fraction, the distribution of the defects inside of the material volume, and the influence of the permittivity and Ohmic conductivity of the host materials and defects.

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Raihan, R. , Rabbi, F. , Vadlamudi, V. and Reifsnider, K. (2015) Composite Materials Damage Modeling Based on Dielectric Properties. Materials Sciences and Applications, 6, 1033-1053. doi: 10.4236/msa.2015.611103.

Conflicts of Interest

The authors declare no conflicts of interest.

References

[1] Reifsnider, K.L. and Case, S.W. (2002) Damage Tolerance and Durability of Material Systems. John Wiley and Sons, New York.
[2] Raihan, R., Adkins, J.M., Baker, J., Rabbi, F. and Reifsnider, K. (2014) Relationship of Dielectric Property Change to Composite Material State Degradation. Composites Science and Technology, 105, 160-165.
http://dx.doi.org/10.1016/j.compscitech.2014.09.017
[3] Raihan, R., Reifsnider, K., Cacuci, D. and Liu, Q. (2015) Dielectric Signatures and Interpretive Analysis for Changes of State in Composite Materials. ZAMM-Journal of Applied Mathematics and Mechanics/Zeitschrift für Angewandte Mathematik und Mechanik.
http://dx.doi.org/10.1002/zamm.201400226
[4] Tuncer, E., Serdyuk, Y.V. and Gubanski, S.M. (2001) Dielectric Mixtures—Electrical Properties and Modeling.
[5] Brosseau, C., Beroual, A. and Boudida, A. (2000) How Do Shape Anisotropy and Spatial Orientation of the Constituents Affect the Permittivity of Dielectrich Eterostructures? Journal of Applied Physics, 88, 7278-7288.
http://dx.doi.org/10.1063/1.1321779
[6] Baker, J., Adkins, J.M., Rabbi, F., Liu, Q., Reifsnider, K. and Raihan, R. (2014) Meso-Design of Heterogeneous Dielectric Material Systems: Structure Property Relationships. Journal of Advanced Dielectrics, 4, 1450008.
http://dx.doi.org/10.1142/S2010135X14500088
[7] Pawar, S.D., Murugavel, P. and Lal, D.M. (2009) Effect of Relative Humidity and Sea Level Pressure on Electrical Conductivity of Air over Indian Ocean. Journal of Geophysical Research: Atmospheres, 114(D2).
[8] Soles, C. and Yee, A. (2000) A Discussion of the Molecular Mechanisms of Moisture Transport in Epoxy Resins. Journal of Polymer Science, Part B: Polymer Physics, 38, 792-802.
http://dx.doi.org/10.1002/(SICI)1099-0488(20000301)38:5<792::AID-POLB16>3.0.CO;2-H
[9] Adamson, M.J. (1980) Thermal Expansion and Swelling of Cured Epoxy Resin Used in Graphite/Epoxy Composite Materials. Journal of Material Science, 15, 1736-1745.
http://dx.doi.org/10.1007/bf00550593
[10] Tencer, M. (1994) Moisture Ingress into Nonhermetic Enclosures and Packages—A Quasisteady State Model for Diffusion and Attenuation of Ambient Humidity Variations. IEEE 44th Electronic Components Technology Conference, Washington DC.
[11] Shirangi, M.H. and Michel, B. (2010) Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds. Moisture Sensitivity of Plastic Packages of IC Devices, Springer, 29-69.
http://dx.doi.org/10.1007/978-1-4419-5719-1_2
[12] Banhegyi, G. and Karasz, F.E. (1986) The Effect of Adsorbed Water on the Dielectric Properties of CaCO3 Filled Polyethylene Composites. Journal of Polymer Science Part B: Polymer Physics, 24, 209-228.
http://dx.doi.org/10.1002/polb.1986.090240201
[13] Banhegyi, G., Hedvig, P. and Karasz, F.E. (1988) DC Dielectric Study of Polyethylene/CaCO3 Composites. Colloid and Polymer Science, 266, 701-715.
http://dx.doi.org/10.1007/BF01410279
[14] Cotinaud, M., Bonniau, P. and Bunsell, A.R. (1982) The Effect of Water Absorption on the Electrical Properties of Glass-Fibre Reinforced Epoxy Composites. Journal of Materials Science, 17, 867-877.
http://dx.doi.org/10.1007/bf00540386
[15] Reid, J.D., Lawrence, W.H. and Buck, R.P. (1986) Dielectric Properties of an Epoxy Resin and Its Composite I. Moisture Effects on Dipole Relaxation. Journal of Applied Polymer Science, 31, 1771-1784.
http://dx.doi.org/10.1002/app.1986.070310622
[16] Paquin, L., St-Onge, H. and Wertheimer, M.R. (1982) The Complex Permittivity of Polyethylene/Mica Composites. IEEE Transactions on Electrical Insulation, 5, 399-404.
http://dx.doi.org/10.1109/TEI.1982.298482

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