[1]
|
Perelaer, J., Smith, P.J., Mager, D., Soltman, D., Volkman, S.K., Subramarian, V., Korvink, J.G. and Schubert, U.S. (2010) Printed Electronics. Journal of Materials Chemistry, 20, 8446-8453. http://dx.doi.org/10.1039/c0jm00264j
|
[2]
|
Yokoyama, M. and Kamata, T. (2008) Advanced Science and Technology for Printable Organic Electronics. CMC Publishers.
|
[3]
|
Minemawari, H., Yamada, T., Matsui, H., Tsutsumi, J., Haas, S., Chiba, R., Kumai, R. and Hasegawa, T. (2011) Inkjet Printing of Single-Crystal Films. Nature, 475, 364-367. http://dx.doi.org/10.1038/nature10313
|
[4]
|
Fukuda, K., Sekina, T., Kobayashi, Y., Takeda, Y., Shimizu, M., Yamashita, N., Kumaki, D., Itoh, M., Nagaoka, M., Toda, T., Saito, S., Kurihara, M., Sakamoto, M. and Tokita, S. (2012) Organic Integrated Circuits Using Room-Tem-perature Sintered Silver Nanoparticles as Printed Electrodes. Organic Electronics, 13, 3296-3301.
http://dx.doi.org/10.1016/j.orgel.2012.09.028
|
[5]
|
Tokuno, T., Nogi, M., Karakawa, M., Jiu, J.T.T., Nge, Y., Aso, K. and Suganuma, K. (2011) Fabrication of Silver Nanowire Transparent Electrodes at Room Temperature. Nano Research, 4, 1215-1222.
http://dx.doi.org/10.1007/s12274-011-0172-3
|
[6]
|
Hosel, M. and Krebs, F.C. (2012) Large-Scale Roll-to-Roll Photonic Sintering of Flexo Printed Silver Nanoparticle Electrodes. Journal of Materials Chemistry, 22, 15683-15688. http://dx.doi.org/10.1039/c2jm32977h
|
[7]
|
Nakamoto, M., Kashiwagi, Y. and Yamamoto, M. (2005) Synthesis and Size Regulation of Gold Nanoparticles by Controlled Thermolysis of Ammonium Gold(I) Thiolates in the Absence or Presence of Amines. Inorganica Chimica Acta, 358, 4229-4236. http://dx.doi.org/10.1016/j.ica.2005.03.037
|
[8]
|
Suganuma, K., Sakamoto, S., Kagami, N., Wakuda, D., Kim, K.S. and Nogi, M. (2012) Low-Temperature Low-Pres-sure Die Attach with Hybrid Silver Particle Paste. Microelectronics Reliability, 52, 375-380.
http://dx.doi.org/10.1016/j.microrel.2011.07.088
|
[9]
|
Morita, T., Ide, E., Yasuda, Y., Hirose, A. and Kobayashi, K.F. (2008) Study of Bonding Technology Using Silver Nanoprticles. Japanese Journal of Applied Physics, 47, 6615. http://dx.doi.org/10.1143/JJAP.47.6615
|
[10]
|
Perelaer, J., Abbel, R., Wtinscher, S., Jani, R., van Lammeren, T. and Schubert, U.S. (2012) Roll-to-Roll Compatible Sintering of Inkjet Printed Features by Photonic and Microwave Exposure. Advanced Materials, 24, 2620.
http://dx.doi.org/10.1002/adma.201104417
|
[11]
|
Kim, Y., Yoo, B.W., Anthony, J.E. and Park, S.K. (2012) Controlled Deposition of a High-Performance Small-Molecule Organic Single-Crystal Transistor Array by Direct Inkjet Printing. Advanced Materials, 24, 497-502.
http://dx.doi.org/10.1002/adma.201103032
|
[12]
|
Choi, Y., Lee, J.H., Kim, S.J., Yoon, D.H. and Byun, Y.H. (2012) Highly Conductive Polymer-Decorated Cu Electrode Film Printed on Glass Substrates with Novel Precursor-Based Ink and Paste. Journal of Materials Chemistry, 22, 3624.
http://dx.doi.org/10.1039/c2jm15124c
|
[13]
|
Ryu, J.G., Kim, H.S. and Hahn, H.T. (2011) Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics. Journal of Electronic Materials, 40, 42-50. http://dx.doi.org/10.1007/s11664-010-1384-0
|
[14]
|
Ishizaki, T. and Watanabe, R. (2012) A New One-Pot Method for the Synthesis of Cu Nanoparticles for Low Temperature Bonding. Journal of Materials Chemistry, 22, 25198-25206. http://dx.doi.org/10.1039/c2jm34954j
|
[15]
|
Wang, B.Y., Yoo, T.H., Song, Y.W., Lim, D.S. and Oh, Y.J. (2013) Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering. Applied Materials & Interfaces, 5, 4113-4119.
|
[16]
|
Araki, T., Sigahara, T., Jiu, J., Nagao, S., Nogi, M., Koga, H., Uchida, H., Shinozaki, K. and Suganuma, K. (2013) Cu Salt Ink Formulation for Printed Electronics Using Photonic Sintering. Langmuir, 29, 11192-11197.
http://dx.doi.org/10.1021/la402026r
|
[17]
|
Nakamoto, K. (1963) Infrared Spectra of Inorganic and Coordination Compounds. John Wiley & Sons, Inc., New York.
|
[18]
|
Bellamy, L.J. (1966) Infrared Spectra of Complex Compounds. Methuen & Co, London.
|
[19]
|
Buffat, P.H. and Borrel, J.P. (1976) Size Effect on the Melting Temperature of Gold Particles. Physical Review A, 13, 2287-2298. http://dx.doi.org/10.1103/PhysRevA.13.2287
|
[20]
|
Li, Y., Moon, K.S. and Wong, C.P. (2006) Enhancement of Electrical Property of Anisotropically Conductive Adhesives (ACAs) Joints via Low Temperature Sintering. Journal of Applied Polymer Science, 99, 1665-1673.
http://dx.doi.org/10.1002/app.22509
|