Fabrication of Copper Wire Using Glyoxylic Acid Copper Complex and Laser Irradiation in Air

Tomoji Ohishi^*, Ryutaro Kimura

Department of Applied Chemistry, Faculty of Engineering, Shibaura Institute of Technology, Koto-ku, Japan.

DOI: 10.4236/msa.2015.69082                

Abstract

Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO₂ laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10^–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.

Keywords

Glyoxylic Acid Copper Complex, CO₂ Laser, Fine Copper Wire, Laser Direct Patterning, Printable Electronics

Conflicts of Interest

The authors declare no conflicts of interest.

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