A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip

DOI: 10.4236/jamp.2015.32030   PDF   HTML   XML   4,752 Downloads   5,192 Views  

Abstract

In semiconductor manufacturing process, probe station that is testing equipment is important. Inspection step is for detecting defects on semiconductor before the packaging. Probe card is a part of probe station and contains probe tip that contacts to semiconductor. Through probe tip, it can inspect defects of semiconductor. In this paper, optimization method is used with response surface analysis to design MEMS type probe tip. And fabricating probe tip uses maskless lithography, electro-plating and lapping process.

Share and Cite:

Kim, K. , Lee, J. , Ha, S. , Cho, Y. and Cho, M. (2015) A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip. Journal of Applied Mathematics and Physics, 3, 201-207. doi: 10.4236/jamp.2015.32030.

Conflicts of Interest

The authors declare no conflicts of interest.

References

[1] Ha, S.J., Kim, D.W., Shin, B.C., Cho, M.W. and Han, C.S. (2010) Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch. Journal of Academia-Industrial Technology, 11, 1210-1215.
[2] Leslie, B. and Matta, F. (1989) Wafer-Level Testing with a Membrane Probe. IEEE Design & Test of Computers, 6, 10-17.
[3] Min, C.H. (2007) Fabrication of Vertical Type Probe Card and MEMS Probe Card for Wafer Level Chip Test. Catholic University.
[4] Kendall, D.L. (1975) On Etching Very Narrow Grooves in Silicon. Appl. Phys. Lett., 26, 195-198. http://dx.doi.org/10.1063/1.88113
[5] Kim, I.G. (2004) Study on the Hardness and Internal Stress of Nickel Electro-deposit. Industrial of Telecommunication Information, 47-56.

  
comments powered by Disqus

Copyright © 2020 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.