[1]
|
Yi, T., Li, L. and Kim, C.J. (2000) Microscale Material Testing of Single Crystalline Silicon: Process Effects on Surface Morphology and Tensile Strength. Sensors and Actuators A: Physical, 83, 172-178. http://dx.doi.org/10.1016/S0924-4247(00)00350-2
|
[2]
|
Pierron, O.N. and Muhlstein, C.L. (2006) The Critical Role of Environment in Fatigue Damage Accumulation in Deep-Reactive Ion-Etched Single-Crystal Silicon Structural Films. Journal of Microelectromechanical Systems, 15, 111-119. http://dx.doi.org/10.1109/JMEMS.2005.863602
|
[3]
|
Alsem, D.H., Boyce, B.L., Stach, E.A. and Ritchie, R.O. (2008) Effect of Post-Release Sidewall Morphology on the Fracture and Fatigue Properties of Polycrystalline Silicon Structural Films. Sensors and Actuators A: Physical, 147, 553-560. http://dx.doi.org/10.1016/j.sna.2008.05.027
|
[4]
|
Liang, E.Z., Hung, S.C., Hsieh, Y.P. and Lin, C.F. (2008) Effective Energy Densities in KrF Excimer Laser Reformation as a Sidewall Smoothing Technique. Journal of Vacuum Science & Technology B, 26, 110-116. http://dx.doi.org/10.1116/1.2825163
|
[5]
|
Hung, S.C., Liang, E.Z. and Lin, C.F. (2009) Silicon Waveguide Sidewall Smoothing by KrF Excimer Laser Reformation. Journal of Lightwave Technology, 27, 887-892. http://dx.doi.org/10.1109/JLT.2008.923240
|
[6]
|
Yan, J.W., Asami, T. and Kuriyagawa, T. (2009) Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd: YAG Laser Irradiation. Key Engineering Materials, 389, 469-474. http://dx.doi.org/10.4028/www.scientific.net/KEM.389-390.469
|
[7]
|
Yan, J., Sakai, S., Isogai, H. and Izunome, K. (2009) Recovery of Microstructure and Surface Topography of Grinding- Damaged Silicon Wafers by Nanosecond-Pulsed Laser Irradiation. Semiconductor Science and Technology, 24, Article ID: 105018. http://dx.doi.org/10.1088/0268-1242/24/10/105018
|
[8]
|
Bosseboeuf, A., Boulmer, J. and Débarre, D. (1997) Planarization of Rough Silicon Surfaces by Laser Annealing. Applied Surface Science, 109, 473-476. http://dx.doi.org/10.1016/S0169-4332(96)00922-1
|
[9]
|
Kim, S.G., Roh, T.M., Kim, J., et al. (2003) Behavior of Trench Surface by H2 Annealing for Reliable Trench Gate Oxide. Journal of Crystal Growth, 255, 123-129. http://dx.doi.org/10.1016/S0022-0248(03)01238-7
|
[10]
|
Lee, M.C.M., and Wu, M.C. (2006) Thermal Annealing in Hydrogen for 3-D Profile Transformation on Silicon-on- Insulator and Sidewall Roughness Reduction. Journal of Microelectromechanical Systems, 15, 338-343. http://dx.doi.org/10.1109/JMEMS.2005.859092
|
[11]
|
Takahashi, J.I., Tsuchizawa, T., Watanabe, T. and Itabashi, S.I. (2004) Oxidation-Induced Improvement in the Sidewall Morphology and Cross-Sectional Profile of Silicon Wire Waveguides. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 22, 2522-2525. http://dx.doi.org/10.1116/1.1800359
|
[12]
|
Sparacin, D.K., Spector, S.J. and Kimerling, L.C. (2005) Silicon Waveguide Sidewall Smoothing by Wet Chemical Oxidation. Journal of Lightwave Technology, 23, 2455-2461. http://dx.doi.org/10.1109/JLT.2005.851328
|
[13]
|
Rogers, J.W. and Phinney, L.M. (2004) Temperature Response of Silicon MEMS Cantilevers during and after Nd: YAG Laser Irradiation. Numerical Heat Transfer, Part A: Applications, 45, 737-750. http://dx.doi.org/10.1080/10407780490440110
|
[14]
|
Rogers, J.W. and Phinney, L.M. (2001) Process Yields for Laser Repair of Aged, Stiction-Failed, MEMS Devices. Journal of Microelectromechanical System, 10, 280-285. http://dx.doi.org/10.1109/84.925783
|
[15]
|
Zhang, X.R. and Xu, X. (2005) Laser Bending for High-Precision Curvature Adjustment of Microcantilevers. Applied Physics Letters, 86, Article ID: 021114. http://dx.doi.org/10.1063/1.1851617
|
[16]
|
Dirscherl, M., Esser, G. and Schmidt, M. (2006) Ultrashort Pulse Laser Bending. Journal of Laser Micro/Nanoengi- neering, 1, 54-60. http://dx.doi.org/10.2961/jlmn.2006.01.0011
|
[17]
|
Mitwally, M.E., Tsuchiya, T., Tabata, O. and Sedky, S. (2014) Improvement of Tensile Strength of Freestanding Single Crystal Silicon Microstructures Using Localized Harsh Laser Treatment. Japanese Journal of Applied Physics, 53, Article ID: 06JM03. http://dx.doi.org/10.7567/JJAP.53.06JM03
|
[18]
|
Tsuchiya, T., Shikida, M. and Sato, K. (2002) Tensile Testing System for Sub-Micrometer Thick Films. Sensors and Actuators A: Physical, 97, 492-496. http://dx.doi.org/10.1016/S0924-4247(01)00862-7
|
[19]
|
Ikehara, T. and Tsuchiya, T. (2008) High-Cycle Fatigue of Micromachined Single-Crystal Silicon Measured Using High-Resolution Patterned Specimens. Journal of Micromechanics and Microengineering, 18, Article ID: 075004. http://dx.doi.org/10.1088/0960-1317/18/7/075004
|
[20]
|
Alsem, D.H., Pierron, O.N., Stach, E.A., Muhlstein, C.L. and Ritchie, R.O. (2007) Mechanisms for Fatigue of Micron-Scale Silicon Structural Films. Advanced Engineering Materials, 9, 15-30. http://dx.doi.org/10.1002/adem.200600269
|
[21]
|
Darif, M., Semmar, N. and Orléans Cedex, F. (2008) Numerical Simulation of Si Nanosecond Laser Annealing by COMSOL Multiphysics. Proceedings of the COMSOL Conference, Hannover, 2008.
|
[22]
|
Anthony, T.R. and Cline, H.E. (1977) Surface Rippling Induced by Surface-Tension Gradients during Laser Surface Melting and Alloying. Journal of Applied Physics, 48, 3888-3894. http://dx.doi.org/10.1063/1.324260
|
[23]
|
Amutha, G., Palani, I.A., Vasa, N.J., Singaperumal, M. and Okada, T. (2013) Investigations on Nano- and Pico-Second Laser Based Annealing Combined Texturing of Amorphous Silicon Thin Films for Photovoltaic Applications. Journal of Solid Mechanics and Materials Engineering, 7, 206-216. http://dx.doi.org/10.1299/jmmp.7.206
|
[24]
|
Palani, I.A., Vasa, N.J., Singaperumal, M. and Okada, T. (2010) Investigation on Laser-Annealing and Subsequent Laser-Nanotexturing of Amorphous Silicon (a-Si) Films for Photovoltaic Application. Journal of Laser Micro/Nanoengi- neering, 5, 150-155. http://dx.doi.org/10.2961/jlmn.2010.02.0010
|
[25]
|
Nayak, B.K., Sun, K., Rothenbach, C. and Gupta, M.C. (2011) Self-Organized 2D Periodic Arrays of Nanostructures in Silicon by Nanosecond Laser Irradiation. Applied Optics, 50, 2349-2355. http://dx.doi.org/10.1364/AO.50.002349
|
[26]
|
De Wolf, I. (1996) Micro-Raman Spectroscopy to Study Local Mechanical Stress in Silicon Integrated Circuits. Semiconductor Science and Technology, 11, 139-154. http://dx.doi.org/10.1088/0268-1242/11/2/001
|
[27]
|
Steen, W.M., Mazumder, J. and Watkins, K.G. (2003) Laser Material Processing. 3rd Edition, Springer-Verlag, London. http://dx.doi.org/10.1007/978-1-4471-3752-8
|
[28]
|
Pedraza, A.J., Fowlkes, J.D. and Lowndes, D.H. (1999) Silicon Microcolumn Arrays Grown by Nanosecond Pulsed- Excimer Laser Irradiation. Applied Physics Letters, 74, 2322-2324. http://dx.doi.org/10.1063/1.123838
|
[29]
|
Sanchez, F., Morenza, J.L., Aguiar, R., Delgado, J.C. and Varela, M. (1996). Whiskerlike Structure Growth on Silicon Exposed to ArF Excimer Laser Irradiation. Applied Physics Letters, 69, 620-622. http://dx.doi.org/10.1063/1.117926
|
[30]
|
Kudryashov, S.I. and Allen, S.D. (2002) Photoacoustic Study of KrF Laser Heating of Si: Implications for Laser Particle Removal. Journal of Applied Physics, 92, 5627-5631. http://dx.doi.org/10.1063/1.1503859
|
[31]
|
Tam, A.C., Leung, W.P., Zapka, W. and Ziemlich, W. (1992) Laser-Cleaning Techniques for Removal of Surface Particulates. Journal of Applied Physics, 71, 3515-3523. http://dx.doi.org/10.1063/1.350906
|
[32]
|
Park, H.K., Grigoropoulos, C.P., Leung, W.P. and Tam, A.C. (1994) A Practical Excimer Laser-Based Cleaning Tool for Removal of Surface Contaminants. IEEE Transactionson on Components, Packaging and Manufacturing Technology, Part A, 17, 631-643. http://dx.doi.org/10.1109/95.335050
|