[1]
|
S. Uhlig and M. Robertsson, “Limitations to and Solutions for Optical Loss in Optical Backplanes,” Journal of Lightwave Technology, Vol. 24, 2006,pp. 1710-1724. doi:10.1109/JLT.2006.870978
|
[2]
|
D. A. B. Miller, “Rationale and Challenges for Optical Interconnects to Electronic Chips,” Proceedings of the IEEE, Vol. 88, 2000, pp. 728-749.
doi:10.1109/5.867687
|
[3]
|
B. S. Rho, W. J. Lee, J. W. Lim, G. W. Kim, C. H. Cho, and S. H. Hwang, “High-Reliability Flexible Optical Printed Circuit Board for Opto-Electric Interconnections,” Optical Engineering, Vol. 48, 2009.
|
[4]
|
T. Shibata and A. Takahashi, “Flexible Opto-Electronic Circuit Board for In-Device Interconnection,” Lake Buena Vista, FL, 2008, pp. 261-267.
|
[5]
|
S. H. Hwang, M. H. Cho, S. K. Kang, H. H. Park, H. S. Cho, S. H. Kim, K. U. Shin and S. W. Ha, “Passively Assembled Optical Interconnection System Based on An Optical Printed-Circuit Board,” IEEE Photonics Technology Letters, Vol. 18, 2006 pp. 652-654.
doi:10.1109/LPT.2006.870127
|
[6]
|
E. Bosman, J. Missinne, B. V. Hoe, G. V. Steenberge, S. Kalathimekkad, J. V. Erps, I. Milenkov, K. Panajotov, T. V. Gijseghem, P. Dubruel, H. Thienpont and P. V. Daele, “Ultrathin Optoelectronic Device Packaging in Flexible Carriers,” IEEE Journal on Selected Topics in Quantum Electronics, Vol. 17, 2011, pp. 617-628.
doi:10.1109/JSTQE.2010.2096407
|
[7]
|
M. Karppinen, T. Alajoki, A. Tanskanen, K. Kataja, J. T. Mäkinen, P. Karioja, M. Immonen and J. Kivilahti, “Parallel Optical Interconnect between Surface-Mounted Devices on FR4 Printed Wiring Board Using Embedded Waveguides and Passive Optical Alignments,” Strasbourg, 2006.
|