High-Frequency Heating for Soldering in Electronics

Vladimir L. Lanin

Electronic Technique and Technology Department, Belarus State University of Informatics and Radioelectronics, Minsk, Belarus.

DOI: 10.4236/cs.2012.33033                

Abstract

Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect; high density of energy; process- ing in any environment, including vacuum or inert gas; high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces.

Keywords

HF Heating; Inductor; Soldering; Electronic Modules

Conflicts of Interest

The authors declare no conflicts of interest.

References

[1]	S. Lupi, Ed., “Induction Heating. Industrial Applications,” U.I.E., Paris, 1992, p. 142.
[2]	S. Zinn and S. L. Semiatin, “Elements of Induction Heating: Design, Control, and Application,” ASM International, 1988, p. 335.
[3]	M. Li, H. Xu, S.-W. R. Lee, J. Kim and D. Kim, “Eddy Current Induced Heating for the Soldering Reflow of Area Array Packages,” IEEE Transactions on Advanced Packaging, Vol. 2, No. 31, 2008, pp. 399-403. doi:10.1109/TADVP.2008.923385
[4]	E. Rapoport and Y. Pleshivseva, “Optimal Control of Induction Heating Processes,” CRS Press, New York, 2007.
[5]	V. L. Lanin, “Efficiency of Heating by Concentrated Flow of Energy in the Process of Soldering in Electronics,” Electronnaya Obrabotka Materialov, No. 2, 2002. pp. 1720.
[6]	V. L. Lanin. “High Frequency Electro-Magnetic Heating in Electronic Systems Soldering Processing,” Electronnaya Obrabotka Materialov, No. 5, 2004. pp. 79-84.
[7]	V. L. Lanin. “Modeling of HF Electro-Magnetic Heating during the Soldering of Electronic Devices,” News of the Belarus Engineering Academy, Vol. 2, No. 14, 2002, pp. 167-168.
[8]	V. L. Lanin, A. P. Dostanko and E. V. Telesh, “Formation of Current-Carrying Connections in Electronics Products,” Minsk, Publication Center of the BSU, 2007, p. 574.