Share This Article:

A Systematic Framework of Equipment Maintenance and Service with Application to Wire Bonder

Abstract Full-Text HTML Download Download as PDF (Size:1015KB) PP. 29-41
DOI: 10.4236/ib.2010.21003    5,735 Downloads   9,742 Views  

ABSTRACT

A systematic framework for the maintenance and service of equipment is developed and proposed. The framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. With axiomatic design mapping, the maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method. The maintenance and service of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is employed for illustration

Conflicts of Interest

The authors declare no conflicts of interest.

Cite this paper

R. Chang, Y. Hsieh and E. Chang, "A Systematic Framework of Equipment Maintenance and Service with Application to Wire Bonder," iBusiness, Vol. 2 No. 1, 2010, pp. 29-41. doi: 10.4236/ib.2010.21003.

References

[1] G. G. Harman, “Wire bonding in microelectronics, material, processes, reliability, and yield,” 2nd edition, McGraw Hill, New York, 1997.
[2] C. Boit, R. Weiland, A. Olbrich, U. Muehle, and B. Simmnacher, “Failure analysis concepts for microelectronics technologies and manufacturing of the future,” Proceedings of SPIE, Vol. 4406, pp. 1–12, 2001.
[3] D. T. Rooney, D. Nager, D. Geiger, and D. Shanguan, “Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds,” Microelectronics Reliability, Vol. 45, No. 2, pp. 379–390, 2005.
[4] A. Garg and S. G. Deshmukh, “Maintenance management: Literature review and directions,” Journal of Quality Maintenance Engineerings, Vol. 12, No. 3, pp. 205–238, 2006.
[5] M. Murray, K. Fletcher, J. Kennedy, P. Kohler, J. Chambers, and T. Ledwidge, “Capability assurance: A generic model of maintenance,” ICOMS-96, Maintenance Engineerings Society of Australia Capability Assurance, paper 72, 1996.
[6] B. S. Blanchard, “System engineering management,” John Wiley & Sons, New York, 1991.
[7] M. Braglia, G. Fantoni, and M. Frosolini, “The house of reliability,” International Journal of Quality and Relia- bility Management, Vol. 24, No. 4, pp. 420–440, 2007.
[8] D. A. Bradley, D. Dawson, N. C. Burd, and A. J. Loader, “Mechatronics: Electronics in products and processes,” Chapman & Hall, London, 1993.
[9] N. P. Suh, “Axiomatic design: Advances and appli- cations,” Oxford Press, New York, 2001.
[10] B. S. El-Haik, “Axiomatic quality: Integrating axiomatic design with six-sigma, reliability, and quality Enginee ring,” John Wiley & Sons, New York, 2005.
[11] H. A. Mohsen and E. Cekecek, “Thoughts on the use of axiomatic designs within the product development process,” Proceedings of 1st International Conference of Axiomatic Design, Cambridge, Massachusetts, USA, 2000.
[12] G. Taguchi, “Taguchi methods: Signal-to-noise ratio for quality evaluation,” Michigan: American Suppliers Institute Press, Vol. 3, 1991.
[13] M. S. Phadke, “Quality engineering using robust design,” Prentice Hall, London, 1989.
[14] R. Whitcomb and M. Rioux, “Failure modes and effects analysis (FMEA) system deployment in a semiconductor manufacturing environment,” Proceedings IEEE/SEMI Advanced Semiconductor Manufacturing Conference Works, pp. 136–139, 1994.
[15] J. B. Bowles, “An assessment of RPN prioritization in a failure modes effects and criticality analysis,” Procee- dings Annual Reliability and Maintainability Symposium, pp. 380–386, 2003.

  
comments powered by Disqus

Copyright © 2019 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.