[1]
|
H. Y. Ma, Y. H. Wang, M. L Wang, et al. “The sequential coupling analysis of a cantilever driving by electrostatic force in an optical switch,” Optical Instruments, Vol. 25, No. 3, pp. 17, 2003.
|
[2]
|
G. Li and N. R. Aluru, “Efficient mixed-domain analysis of electrostatic MEMS,” ICCAD, pp. 474, 2002.
|
[3]
|
T. Y. Zhang, Y. J. Su, C. F. Qian, et al. “Micro-bridge testing of silicon nitride thin films deposited on silicon wafers,” Acta Mater, Vol. 48, pp. 2843, 2000.
|
[4]
|
Y. Zhou, C. S. Yang, J. A. Chen, et al. “Investigation of Young’s modulus and residual stress of copper film micro- bridges by MEMS technology,” Modern Scientific Instruments, Vol. 4, pp. 45, 2003.
|
[5]
|
M. J. Wang, Y. Zhou, J. A. Chen, et al. “Measurements of elastic modulus and residual stress of nickel film by micro- bridge testing methods,” Electronic Components & Materials, Vol. 23, No. 12, pp. 13, 2004.
|
[6]
|
H. Yang, M. H. Bao, S. Q. Shen, et al. “The displacement characteristics of the micromechanical structures driven by electrostatic force,” Journal of Fudan University (Natural Science), Vol. 38, No. 3, pp. 282, 1999.
|
[7]
|
H. Rong, Q. A. Huang, M. Nie, et al. “An analytical model for pull-in voltage of doubly-clamped multi-layer beams,” Chinese Journal of Semiconductors, Vol. 24, No. 11, pp. 1185, 2003.
|
[8]
|
D. H. Sun, Y. Q. Huang, W. Zheng, et al. “On the modeling methodology of MEMS system-level simulation,” Journal of Xiamen University (Natural Science), Vol. 40, No. 2, pp. 297, 2001.
|
[9]
|
M. Nie, Q. A. Huang, J. H. Wang, et al. “Analysis of deflection and pull-in voltage of a multi-layer cantilever under an electrostatic load,” Chinese Journal of mechanical engineering, Vol. 40, No. 8, pp. 72, 2004.
|
[10]
|
Y. Y. Wang, T. I. Kamins, B. Y. Zhao, et al. Polysilicon Film and its Application in IC (2nd Version), Science Press, Beijing, 2001.
|
[11]
|
C. S. Wang, W. B. Zhang, J. Fang, et al. “Research on coupled electro-mechanical analysis and application for typical components in MEMS,” Journal of Mechanical Strength, Vol. 23, No. 4, pp. 503, 2001.
|
[12]
|
P. M. Osterberg, S. D. Senturia, “M-test: A test chip for MEMS material property measurement using electrostatically actuated test structures,” Journal of Microelectromechanical Systems, Vol. 6, No. 2, pp. 107, 1997.
|