Author(s)

S. Schaible¹, C. Bernet¹, P. Ledergeber¹, T. Balmer², C. Brändli^1*

¹Institute of Materials and Process Engineering, Zurich University of Applied Sciences, Winterthur, Switzerland.
²Sonova AG, Staefa, Switzerland.

A selection of 22 low-melting polymers was thermally and rheologically evaluated to be used as hot-melt adhesives in mixed-substrate joining samples. The choice of polymers was based on the published melting point. It was required to include a broad variety of different polymers backbones to study the influence of the different polymers comprehensively. A tool-box of widely applicable tests was developed to judge if a thermoplastic polymer is suitable for a hot-melt adhesive application. Melting temperature (onset, peak and offset temperature) and melting enthalpy were determined using standardized methods. Rheological methods were used to characterize the shear rate dependence and the flow behavior at the application temperature. The wetting behavior of the polymers was evaluated with contact angle measurements. The adhesive strength of the most promising candidates was analyzed using the Lumi Frac-adhesion method including the failure pattern.

Hot-Melt Adhesives, Thermal Analysis, Rheology, Mechanical Properties

Schaible, S. , Bernet, C. , Ledergeber, P. , Balmer, T. and Brändli, C. (2016) Basic Study on the Evaluation of Thermoplastic Polymers as Hot-Melt Adhesives for Mixed-Substrate Joining. Open Journal of Applied Sciences, 6, 579-592. doi: 10.4236/ojapps.2016.68057.