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Review of Evolution and Rising Significance of Wafer-Level Electroplating Equipment in Semiconductor Manufacturing
Electronics,
2025
DOI:10.3390/electronics14050894
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[2]
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Electrochemical spectroscopic analysis of additives in copper plating baths by DRT and multivariate approach
Journal of Electroanalytical Chemistry,
2024
DOI:10.1016/j.jelechem.2024.118045
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[3]
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Electrodeposition of Ru on Nanoscale Trench Patterns
ECS Journal of Solid State Science and Technology,
2024
DOI:10.1149/2162-8777/ad4677
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[4]
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Q-time Assessment on Electroplated Nickel/Gold Interface Quality
2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
2024
DOI:10.1109/ASMC61125.2024.10545502
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[5]
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New Insights into the Modulation of Island Density of Electrodeposits Using Pulsatile Waveforms
The Journal of Physical Chemistry C,
2024
DOI:10.1021/acs.jpcc.4c01661
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[6]
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A dynamically equivalent atomistic electrochemical paradigm for the larger-scale experiments
The Journal of Chemical Physics,
2024
DOI:10.1063/5.0208367
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[7]
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Electroplating in the modern era, improvements and challenges: A review
Hybrid Advances,
2024
DOI:10.1016/j.hybadv.2024.100286
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[8]
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Artificial intelligence and computational chemistry: a new perspective for electroplating-surface-interface research
SCIENTIA SINICA Chimica,
2023
DOI:10.1360/SSC-2023-0142
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[9]
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Artificial intelligence and computational chemistry: a new perspective for electroplating-surface-interface research
SCIENTIA SINICA Chimica,
2023
DOI:10.1360/SSC-2023-0142
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[10]
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Fundamentals of interface science for electronically electroplated in chip manufacturing: a review of the 341st “shuangqing forum”
SCIENTIA SINICA Chimica,
2023
DOI:10.1360/SSC-2023-0184
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[11]
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Effects of temperature on microstructures of MSA-type electroplating solution: a coarse-grained molecular dynamics simulation
Physical Chemistry Chemical Physics,
2023
DOI:10.1039/D3CP03342B
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[12]
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Electrocrystallization and Morphology of Copper Coatings in the Presence of Organic Additives
Coatings,
2023
DOI:10.3390/coatings13111896
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[13]
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Integrated Circuit Fabrication
2023
DOI:10.1017/9781009303606.012
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[14]
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Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating
Materials Chemistry and Physics,
2022
DOI:10.1016/j.matchemphys.2022.126338
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[15]
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Effect of tin dioxide sol on the peculiarities of electrodeposition and structure of copper and nickel coatings
Surfaces and Interfaces,
2022
DOI:10.1016/j.surfin.2022.102054
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[16]
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Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating
Materials Chemistry and Physics,
2022
DOI:10.1016/j.matchemphys.2022.126338
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[17]
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Effect of tin dioxide sol on the peculiarities of electrodeposition and structure of copper and nickel coatings
Surfaces and Interfaces,
2022
DOI:10.1016/j.surfin.2022.102054
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[18]
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Effect of tin dioxide sol on the peculiarities of electrodeposition and structure of copper and nickel coatings
Surfaces and Interfaces,
2022
DOI:10.1016/j.surfin.2022.102054
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[19]
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Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology
Journal of Welding and Joining,
2021
DOI:10.5781/JWJ.2021.39.3.8
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[20]
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Application of Machine Learning-Based Electrochemical Deposition Models to CMP Modeling
Mathematical Problems of Computer Science,
2020
DOI:10.51408/1963-0051
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