Scanning Electron Microscopy (SEM) Analysis and Hardness of Diffusion Bonded Titanium-Titanium and Titanium-Copper Plates with Static Force and without Interlayers

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ISSN Print: 2164-5612
ISSN Online: 2164-5655
www.scirp.org/journal/ojcm
E-mail: ojcm@scirp.org

"Scanning Electron Microscopy (SEM) Analysis and Hardness of Diffusion Bonded Titanium-Titanium and Titanium-Copper Plates with Static Force and without Interlayers"
written by Joel Hemanth,
published by Open Journal of Composite Materials, Vol.7 No.2, 2017

has been cited by the following article(s):

[1]	PATLAMALI KAYNAK YÖNTEMİ İLE BAKIR-TİTANYUM BİMETALİK KOMPOZİT MALZEME ÜRETİLMESİ VE ARAYÜZEY ETÜDÜ
	2023

[2]	The Effect of Interface Morphology on the Electro-Mechanical Properties of Ti/Cu Clad Composites Produced by Explosive Welding
	2020

[3]	Towards a better understanding of the phase transformations in explosively welded copper to titanium sheets
	2020

[1]	Towards a better understanding of the phase transformations in explosively welded copper to titanium sheets Materials Science and Engineering: A, 2020 DOI:10.1016/j.msea.2020.139285

[2]	The Effect of Interface Morphology on the Electro-Mechanical Properties of Ti/Cu Clad Composites Produced by Explosive Welding Metallurgical and Materials Transactions A, 2020 DOI:10.1007/s11661-019-05537-x

[3]	The Effect of Interface Morphology on the Electro-Mechanical Properties of Ti/Cu Clad Composites Produced by Explosive Welding Metallurgical and Materials Transactions A, 2019 DOI:10.1007/s11661-019-05537-x

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