Adsorption of Copper from an Ammonia-Thiosulfate Media Using DOWEX 550A Ion Exchange Resin

Journals Menu

Follow SCIRP

ISSN Print: 2168-2054
ISSN Online: 2168-2062
www.scirp.org/journal/ijnm
E-mail: ijnm@scirp.org

"Adsorption of Copper from an Ammonia-Thiosulfate Media Using DOWEX 550A Ion Exchange Resin"
written by Cristian Vargas, Patricio Navarro,
published by International Journal of Nonferrous Metallurgy, Vol.5 No.4, 2016

has been cited by the following article(s):

[1]	Antagonistic Separation of Nickel Over Copper from Ammoniacal Binary Solution Using LIX 84-IC Mixture with TBP
	TMS Annual Meeting & Exhibition, 2024

[2]	Liquid–liquid separation of copper and nickel ammine complexes using phenolic oxime mixture with tributyl phosphate
	Geosystem Engineering, 2023

[3]	Simple and complete separation of copper from nickel in the ammoniacal leach solutions of metal coated ABS plastic waste by antagonistic extraction using a mixture …
	2021

[4]	Copper Recovery from Rinse Waters after Ammoniac Etching of Printed Circuit Boards
	2020

[5]	Novel Capacitive Sensors for Chemical and Physical Monitoring in Microfluidic Devices
	2019

[1]	Rare Metal Technology 2024 The Minerals, Metals & Materials Series, 2024 DOI:10.1007/978-3-031-50236-1_25

[2]	Recovery of copper from ammonia–ammonium chloride leach liquor using sterically hindered beta-diketone Mineral Processing and Extractive Metallurgy: Transactions of the Institutions of Mining and Metallurgy, 2024 DOI:10.1177/25726641241276265

[3]	Liquid–liquid separation of copper and nickel ammine complexes using phenolic oxime mixture with tributyl phosphate Geosystem Engineering, 2023 DOI:10.1080/12269328.2023.2187887

[4]	Copper Recovery from Rinse Waters after Ammoniac Etching of Printed Circuit Boards Solid State Phenomena, 2020 DOI:10.4028/www.scientific.net/SSP.299.998

[5]	Copper Recovery from Rinse Waters after Ammoniac Etching of Printed Circuit Boards Solid State Phenomena, 2020 DOI:10.4028/www.scientific.net/SSP.299.998

[6]	Copper Recovery from Rinse Waters after Ammoniac Etching of Printed Circuit Boards Solid State Phenomena, 2020 DOI:10.4028/www.scientific.net/SSP.299.998

Follow SCIRP