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Optimization of corner compensations in wet etching of silicon for a MEMS Z-axis accelerometer
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An arrayed-window microfluidic device for observation of mixed nanoparticles with an X-ray free-electron laser
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Microsystem Technologies,
2022
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Wet bulk micromachining characteristics of Si{110} in NaOH-based solution
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Optimization of Corner Compensations in Wet Etching of Silicon for a Mems Z-Axis Accelerometer
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Effective improvement in the etching characteristics of Si{110} in low concentration TMAH solution
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High Speed Surface Illuminated Si Photodiode Using Microstructured Holes for Absorption Enhancements at 900–1000 nm Wavelength
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A measurement free pre-etched pattern to identify the <110> directions on Si{110} wafer
Microsystem Technologies,
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Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS
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A detailed investigation and explanation of the appearance of different undercut profiles in KOH and TMAH
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Anisotropic etching on Si{1 1 0}: experiment and simulation for the formation of microstructures with convex corners
Journal of Micromechanics and Microengineering,
2014
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