[1]
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Finite Elements Analysis of LED's Solder Joints During Power Thermal Cycling
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
2022
DOI:10.1109/ESTC55720.2022.9939493
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[2]
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Thermal-Mechanical FE Analysis of IGBT Module with Different Power Terminal Shape
2020 21st International Conference on Electronic Packaging Technology (ICEPT),
2020
DOI:10.1109/ICEPT50128.2020.9202631
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[3]
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FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBT
2018 19th International Conference on Electronic Packaging Technology (ICEPT),
2018
DOI:10.1109/ICEPT.2018.8480581
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[4]
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Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
Microelectronics Reliability,
2018
DOI:10.1016/j.microrel.2018.07.044
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[5]
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Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations
Microelectronics Reliability,
2018
DOI:10.1016/j.microrel.2018.07.082
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[6]
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Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip
International Symposium on Microelectronics,
2018
DOI:10.4071/2380-4505-2018.1.000084
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[7]
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Electro-thermal and thermal-mechanical FE analysis of IGBT module with different bonding wire shape
2017 18th International Conference on Electronic Packaging Technology (ICEPT),
2017
DOI:10.1109/ICEPT.2017.8046514
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[8]
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Power Cycling Reliability of Power Module: A Survey
IEEE Transactions on Device and Materials Reliability,
2016
DOI:10.1109/TDMR.2016.2516044
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[9]
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Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding
Journal of Power Electronics,
2016
DOI:10.6113/JPE.2016.16.5.1843
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[10]
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Projecting LED product life based on application
Fifteenth International Conference on Solid State Lighting and LED-based Illumination Systems,
2016
DOI:10.1117/12.2240464
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[11]
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Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings
Advances in Manufacturing,
2014
DOI:10.1007/s40436-014-0054-5
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