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2025
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Speleothem-Inspired Copper/Nickel Interfaces for Enhanced Liquid–Vapor Transport by Marangoni and Soret Effects
Langmuir,
2024
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Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials
ACS Applied Electronic Materials,
2022
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Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics
ACS Applied Materials & Interfaces,
2022
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Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics
ACS Applied Materials & Interfaces,
2022
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Amine functional silica–supported bimetallic Cu-Ni nanocatalyst and investigation of some typical reductions of aromatic nitro-substituents
Colloid and Polymer Science,
2022
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ACS Applied Electronic Materials,
2022
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[8]
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Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures
ACS Applied Materials & Interfaces,
2021
DOI:10.1021/acsami.1c04235
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[9]
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Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures
ACS Applied Materials & Interfaces,
2021
DOI:10.1021/acsami.1c04235
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