Circuits and Systems

Circuits and Systems

ISSN Print: 2153-1285
ISSN Online: 2153-1293
www.scirp.org/journal/cs
E-mail: cs@scirp.org
"Review of the Global Trend of Interconnect Reliability for Integrated Circuit"
written by Qian Lin, Haifeng Wu, Guoqing Jia,
published by Circuits and Systems, Vol.9 No.2, 2018
has been cited by the following article(s):
  • Google Scholar
  • CrossRef
[1] Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects
International Journal of …, 2022
[2] Accurate Crosstalk Noise Modeling and Analysis of Non-Identical Lossy Interconnections Using Convex Optimization Method
IEEE Transactions on …, 2022
[3] A closed-form transient response of coupled transmission lines
IEEE Systems Journal, 2021
[4] Percolation with plasticity for neuromorphic systems
2020
[5] Performance Evaluation of On-chip Interconnect System using Prospective Neural Network Design
2020
[6] Impact of Ge pre-amorphization implantation on Co/Co-Ti/n+-Si contacts in advanced Co interconnects
2020
[7] Variability Analysis of On-Chip Interconnect System Using Prospective Neural Network
2020
[8] Study of electromigration in integrated circuits at design level: Estudo da eletromigração em circuitos integrados na fase de projeto
2020
[9] Эпитаксия слоев GaN (0001) или GaN (1011) на подложке Si (100)
2019
[10] Эпитаксия слоев GaN (0001) или GaN (10 11) на подложке Si (100)
2019
[11] Epitaxy of GaN(0001) and GaN(101) Layers on Si(100) Substrate
2019
[12] Эпитаксия слоев GaN(0001) или GaN(101) на подложке Si(100)
Письма в Журнал …, 2019
[13] Silicon-on-insulator with hybrid orientations for heterogeneous integration of GaN on Si (100) substrate
AIP Conference Proceedings, 2018
[14] Study of Electromigration in Integrated Circuits at Design Level Estudo da Eletromigração em Circuitos Integrados na Fase de Projeto
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top