Numerical Study on Heat Transfer Characteristics of Heated/Cooled Rods Having a Composite Board in between: Effect of Thermal Vias

Journals Menu

Follow SCIRP

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org

Citations h5-index & Ranking*

"Numerical Study on Heat Transfer Characteristics of Heated/Cooled Rods Having a Composite Board in between: Effect of Thermal Vias"
written by Yasushi Koito, Toshio Tomimura,
published by Journal of Electronics Cooling and Thermal Control, Vol.7 No.4, 2017

has been cited by the following article(s):

No relevant information.

Follow SCIRP