"
Key Issues for Implementing Smart Polishing in Semiconductor Failure Analysis"
written by Jacobus Leo, Hao Tan, Yinzhe Ma, Shreyas M. Parab, Yamin Huang, Dandan Wang, Lei Zhu, Jeffrey Lam, Zhihong Mai,
published by
Journal of Applied Mathematics and Physics,
Vol.5 No.9, 2017
has been cited by the following article(s):
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[1]
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Advanced Physical Failure Analysis Techniques for Rescuing Damaged Samples with Cracks, Scratches, or Unevenness in Delayering
Advances in Science, Technology and Engineering Systems Journal,
2021
DOI:10.25046/aj060407
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[2]
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Advanced Sample Preparation Techniques for Rescuing Damaged Samples with Cracks, Scratches, or Unevenness in Delayering
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
2020
DOI:10.1109/IPFA49335.2020.9260868
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