Numerical Study of Conjugate Heat Transfer for Cooling the Circuit Board

Journals Menu

Follow SCIRP

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org

Citations h5-index & Ranking*

"Numerical Study of Conjugate Heat Transfer for Cooling the Circuit Board"
written by Abdullah Alrashidi,
published by Journal of Electronics Cooling and Thermal Control, Vol.6 No.3, 2016

has been cited by the following article(s):

[1]	Numerical simulation of thermal behavior for electronic enclosure
	AIP Conference Proceedings, 2021

[2]	UNCERTAINTIES IN MODELING THE THERMAL STATE OF COOLED GAS TURBINE BLADE/НЕОПРЕДЕЛЕННОСТИ ПРИ МОДЕЛИРОВАНИИ ТЕПЛОВОГО …
	2019

[3]	НЕОПРЕДЕЛЕННОСТИ ПРИ МОДЕЛИРОВАНИИ ТЕПЛОВОГО СОСТОЯНИЯ ОХЛАЖДАЕМОЙ ЛОПАТКИ ГАЗОВОЙ ТУРБИНЫ
	2019

[4]	Effects of Rayleigh number and wall conductivity on conjugate natural convection of nanofluid in a heat conducting rectangular vertical walled enclosure
	AIP Conference Proceedings, 2018

[5]	A spatial economics perspective on convergence research of carbon emissions performance in China
	2018

[6]	Effect of conjugate heat transfer on flow of nanofluid in a rectangular enclosure
	International Journal of Heat and Technology, 2018

[7]	Effect of conjugate heat transfer on flow of nanofluid in a rectangular enclosure Effect of conjugate heat transfer on flow of nanofluid in a rectangular …
	I Zahan

Follow SCIRP