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[1]
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Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES)
Scientific Reports,
2023
DOI:10.1038/s41598-023-45083-6
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[2]
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Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation
Applied Physics Letters,
2023
DOI:10.1063/5.0176416
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[3]
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A phase-field model of electrochemical migration for silver-based conductive adhesives
Electrochimica Acta,
2023
DOI:10.1016/j.electacta.2023.143388
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[4]
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Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing
Journal of Electronic Materials,
2022
DOI:10.1007/s11664-021-09377-7
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[5]
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Experimental evaluation of threshold current density for electromigration damage in Al interconnect line with reservoir and sink structure
Mechanical Engineering Letters,
2022
DOI:10.1299/mel.22-00035
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[6]
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Recent advances in techniques for fabrication and characterization of nanogap biosensors: A review
Biotechnology and Applied Biochemistry,
2022
DOI:10.1002/bab.2212
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[7]
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Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formation
Microelectronics Reliability,
2021
DOI:10.1016/j.microrel.2021.114060
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[8]
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Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formation
Microelectronics Reliability,
2021
DOI:10.1016/j.microrel.2021.114060
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[9]
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Electromigration Effect in Segmented Electrodes of Metallized Film Capacitors
2021 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus),
2021
DOI:10.1109/ElConRus51938.2021.9396430
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[10]
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Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing
Microelectronics Reliability,
2020
DOI:10.1016/j.microrel.2020.113995
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[11]
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Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing
Journal of Electronic Materials,
2018
DOI:10.1007/s11664-017-6038-z
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[12]
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Synthesis of Copper Oxide Aided by Selective Corrosion in Cu Foils
Advances in Materials Science and Engineering,
2018
DOI:10.1155/2018/4231571
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[13]
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Evaluation of threshold current density of electromigration damage considering passivation thickness
2016 International Conference on Advances in Electrical, Electronic and Systems Engineering (ICAEES),
2016
DOI:10.1109/ICAEES.2016.7888035
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