Open Journal of Business and Management

Open Journal of Business and Management

ISSN Print: 2329-3284
ISSN Online: 2329-3292
www.scirp.org/journal/ojbm
E-mail: ojbm@scirp.org
"Emerging Business Trends in the Microelectronics Industry"
written by Samar K. Saha,
published by Open Journal of Business and Management, Vol.4 No.1, 2016
has been cited by the following article(s):
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  • CrossRef
[1] Lead scratch resolution through wirebonding process optimization on qfn packages
2020
[2] FinFET Devices for VLSI Circuits and Systems
2020
[3] A Study of Die Shear Test Performance on Different Diebond Machine Platforms
2020
[4] Leadframe Design Enhancement for Elimination of Burrs at Singulation Process
2020
[5] Ball Misplace Mitigation through Process Optimization of Advanced Leadframe Package
2020
[6] Elimination of Smashed Ball Defect through Process and Design Improvement
2020
[7] Die Attach Machine Selection for Glue Voids Reduction Performance
2020
[8] Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages
2020
[9] Process Optimization to Eliminate Automatic Alignment Failures on the Scalable Device
2020
[10] Addressing Package Voids on Extremely Small Leadframe Device
2020
[11] Resolution of Damaged Metallization on Highly Complex Semiconductor Device
2020
[12] The poetics of one's testimony
2020
[13] Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling
2020
[14] Pick and Place Process Defect Mitigation on Semiconductor BGA Device
2020
[15] Transitioning Semiconductor Companies Enabling Smart Environments and Integrated Ecosystems
2018
[16] Advances in Business and Management
2018
[17] Fabless Semiconductor Firms' Financial Performance Determinant Factors: Product Platform Efficiency and Technological Capability
2018
[18] Circuit Obfuscation and Oracle-guided Attacks: Who can Prevail?
GLSVLSI 2017 Proceedings of the on Great Lakes Symposium on VLSI 2017, 2017
[19] Cost-Benefit Analysis of Computer-Aided Technology Customization Projects
2017
[20] Nanotechnology for Microelectronics and Photonics
2017
[21] CYBER SUPPLY CHAIN SECURITY: CAN THE BACKDOOR BE CLOSED WITH TRUSTED DESIGN, MANUFACTURING AND SUPPLY
2016
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