Journal of Electronics Cooling and Thermal Control

Journal of Electronics Cooling and Thermal Control

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org
"Effect of Non-Condensable Gas Leakage on Long Term Cooling Performance of Loop Thermosyphon"
written by Hiroyuki Toyoda, Yoshihiro Kondo,
published by Journal of Electronics Cooling and Thermal Control, Vol.3 No.4, 2013
has been cited by the following article(s):
  • Google Scholar
  • CrossRef
[1] Experimental Investigation of Geyser Boiling in a Small Diameter Two-Phase Loop Thermosyphon
2020
[2] A Compact Integrated Thermosyphon Heat Sink for Power Electronics Cooling
2019
[3] Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink
International Electronic Packaging Technical Conference and Exhibition, 2019
[4] Heat transfer performance of a lubricant-infused thermosyphon at various filling ratios
International Journal of Heat and Mass Transfer, 2017
[5] Thermosiphon with vapor separation: Experimental comparison to conventional type
Applied Thermal Engineering, 2017
[6] Role of impregnated lubricant in enhancing thermosyphon performance
International Journal of Heat and Mass Transfer, 2017
[7] Design and development of a two-phase closed loop thermosyphon for CPU cooling
2015
[8] Calculation Method for Forced-Air Convection Cooling Heat Transfer Coefficient of Multiple Rows of Memory Cards
Journal of Electronics Cooling and Thermal Control, 2014
[9] Evaporation Heat Transfer Characteristics of Heated Surface with Thin Powder Porous Layer
Heat Pipe Science and Technology, An International Journal, 2014
[10] Forced Convection Heat Transfer Coefficient and Pressure Drop of Diamond-Shaped Fin-Array
Journal of Electronics Cooling and Thermal Control, 2014
[11] CHARACTERISTICS OF EVAPORATION HEAT TRANSFER ON HEATED SURFACE WITH THIN POWDER POROUS LAYER
Heat Pipe Science and Technology, An International Journal, 2013
[12] Kondenzace vodní páry za přítomnosti inertního plynu
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top